Title:
基板接合装置および接合基板の製造方法
Document Type and Number:
Japanese Patent JP7476720
Kind Code:
B2
Abstract:
To provide a substrate bonding device and a method of manufacturing a bonded substrate capable of reducing generation of voids and contamination.SOLUTION: A substrate bonding device 100 that manufactures a bonded substrate by bonding a bandgap semiconductor substrate S and a handle substrate P with each other, comprises: a substrate holder 20 that has a first holding part 211 having a first holding surface 211a for holding any one of the bandgap semiconductor substrate and the handle substrate, a second holding part 211 having a second holding surface 221a for holding the other of the bandgap semiconductor substrate and the handle substrate, and an arm that changes the first and second holding surfaces to a vertically-downward direction and a mutually-facing direction; and an ultraviolet lamp 50 that irradiates a bonding surface of at least one of the bandgap semiconductor substrate and the handle substrate held by the substrate holder with an ultraviolet ray.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
Takashi Sato
Application Number:
JP2020138589A
Publication Date:
May 01, 2024
Filing Date:
August 19, 2020
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
H01L21/02; H01L21/677; H01L21/683
Domestic Patent References:
| JP2009071002A | ||||
| JP2006332563A | ||||
| JP2020090421A | ||||
| JP2019210162A | ||||
| JP9082588A |
Foreign References:
| WO2020022015A1 |
Attorney, Agent or Firm:
Fumio Takino
Toshiaki Tsuda
Yasuhiro Fukuda
Atsushi Watanabe
Toshiaki Tsuda
Yasuhiro Fukuda
Atsushi Watanabe