Title:
基板の貼り合わせ方法、並びに、マイクロチップおよびその製造方法
Document Type and Number:
Japanese Patent JP6531749
Kind Code:
B2
Abstract:
Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.
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Inventors:
Motohiro Sakai
Shinji Suzuki
Fumitoshi Takemoto
Kenichi Hirose
Shinji Suzuki
Fumitoshi Takemoto
Kenichi Hirose
Application Number:
JP2016225765A
Publication Date:
June 19, 2019
Filing Date:
November 21, 2016
Export Citation:
Assignee:
Ushio, Inc.
International Classes:
B29C65/00; B01J19/00; B81C3/00; C03C27/06; G01N35/08; G01N37/00
Domestic Patent References:
| JP2004136637A | ||||
| JP2006187730A | ||||
| JP2006038657A | ||||
| JP2002144300A | ||||
| JP2016099583A | ||||
| JP2004154898A | ||||
| JP2016147828A1 | ||||
| JP2014010299A1 |
Foreign References:
| US20030106799 |
Attorney, Agent or Firm:
Nobuo Fujimoto