Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE CARRIER
Document Type and Number:
Japanese Patent JP3395799
Kind Code:
B2
Abstract:

PURPOSE: To retain a semiconductor wafer to the tip of a substrate fork and then prevent position deviation despite vibration on transfer by providing a cut-out part at a part colliding with the post of a wafer boat at the main part of the substrate fork.
CONSTITUTION: Since a cut-out part 44 is provided at the tip part of a substrate fork 30, a semiconductor wafer 4 can be transferred from a substrate fork 30 to a wafer boat 3 or vice versa without causing the collision of the post 43 of the wafer boat 3 when transferring between the substrate fork 30 and the wafer boat 3. Further, even if vibration in horizontal direction or of rotary move by a transfer machine 21 during the placement or vibration in up/down movement by a raise/lower mechanism 22 is applied to the substrate fork 30, side deviation can be prevented by a protruding part 40 located at the substrate fork 30, thus preventing a falling accident. Also, the cut-out part 44 provided at the substrate fork 30 is matched to the shape of the wafer boat 3 and a protruding part 40 can be left in a state for supporting the semiconductor wafer 4 to cope with any shape.


Inventors:
Akira Ohsawa
Application Number:
JP34757093A
Publication Date:
April 14, 2003
Filing Date:
December 24, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
東京エレクトロン株式会社
International Classes:
B65G49/07; H01L21/22; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B65G49/07; H01L21/22
Domestic Patent References:
JP513550A
JP5314942A
JP4336412A
JP4139855A
JP2139947A
JP531238U
Attorney, Agent or Firm:
Noriyuki Kanesaka