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Title:
SUBSTRATE CLEANING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JPH11102881
Kind Code:
A
Abstract:

To realize simplification of a cleaning device and shortening of cleaning time, without giving damages to a substrate by a method wherein electrically insulated abrasive grains are vibrated by ultrasonic waves.

Air bubbles are generated by cavitation, when ultrasonic waves are generated in an ultrasonic wave cleaning vessel 1. Abrasive grains P contained in a cleaning liquid are vibrated by air bubbles on a substrate 13 by the pressure generated by the air bubbles. The abrasive grains P come into collision with particles 14 adhered to the substrate 13 through the vibrations, the particles 14 are separated from the substrate 13 by themselves, the particles 14 are removed, and the substrate 13 is cleaned. In this case, since the abrasive grains P have electrical insulating property, their electrification can be suppressed, the adhesion of the abrasive grains to the substrate 13 is prevented, nor are the abrasive grains P contained in the cleaning liquid. Moreover, the abrasive grains P can be separated easily from the substrate when rinsing, and the effect of washing can be accelerated. When the cleaning liquid containing the electric insulating abrasive grains having different average grain diameters is used, adequate cleaning effect can be secured in a short period of time by its synergistic effect.


Inventors:
KISHIMOTO KATSUSHI
SANNOMIYA HITOSHI
Application Number:
JP26124197A
Publication Date:
April 13, 1999
Filing Date:
September 26, 1997
Export Citation:
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Assignee:
SHARP KK
International Classes:
B08B3/12; H01L21/304; (IPC1-7): H01L21/304; B08B3/12



 
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