SUBSTRATE CONVEYING METHOD AND SUBSTRATE CONVEYING DEVICE

Title:

SUBSTRATE CONVEYING METHOD AND SUBSTRATE CONVEYING DEVICE

Document Type and Number:

Japanese Patent JP2006193267

Kind Code:

A

Abstract:

To provide a substrate conveying method and a substrate conveying device capable of smoothly conveying a large substrate inclined at a large angle by reducing inconsistency of inclined conveyance associated with an increase in size of the substrate.

The substrate conveying device 10 to convey a substrate 11 with an angle of inclination with respect to the horizontal plane has a substrate curving and supporting means 14 to curve the substrate 11 to be conveyed so as to have the curvature in the conveying direction, and the substrate curving and supporting means 14 includes a substrate back side supporting means 15 and a substrate lower end supporting means 16.

Inventors:

YONETANI MASATO
ISHIDA JUNICHI

Application Number:

JP2005005625A

Publication Date:

July 27, 2006

Filing Date:

January 12, 2005

Export Citation:

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Assignee:

SHARP KK

International Classes:

B65G49/06; B65G13/02; B65G13/08; B65G47/22; H01L21/677

Attorney, Agent or Firm:

Keiichiro Saikyo
Takeshi Sugiyama
Minetarou Hirose

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