SUBSTRATE FOR ELECTRO-OPTIC DEVICE, ELECTRO-OPTIC DEVICE, ELECTRONIC APPARATUS AND PROJECTION TYPE DISPLAY DEVICE

Japanese Patent JP3767154

B2

PROBLEM TO BE SOLVED: To embody a structure capable of achieving the uniformization of a polishing rate without increasing the film thicknesses of interlayer insulating films relating to the films to be polished with a substrate for a liquid crystal panel having a laminated film structure obtd. by alternately and repetitively depositing the interlayer insulating films and metallic layers on a semiconductor substrate into which element regions of transistors for pixel selection are built. SOLUTION: This substrate for the liquid crystal panel has connecting plugs 15 for conducting and connecting wiring films 10 consisting of the first metallic layer across the second interlayer insulating film 11 under a lightproof film through apertures 12a opened at the lightproof film 12 consisting of the second material layer in the pixel regions and pixel electrodes consisting of the third metallic layer across the third interlayer insulating film 13 on the lightproof film. Lower layer dummy patterns A consisting of the first metallic layer and the upper layer dummy patterns B consisting of the second metallic layer are superposed and formed on the circumferences of the input terminal pads 26 of the non-pixel regions. Since the level of the deposition surface of the third interlayer insulating film 13 on the dummy patterns A, B is raised, the excessive polishing in these parts may be eliminated. The uniform polishing rate is, therefore, obtd. in CMP treatment.