Title:
SUBSTRATE FOR ELECTRONIC COMPONENT PACKAGING, AND PACKAGE EMPLOYING IT
Document Type and Number:
Japanese Patent JP2007129001
Kind Code:
A
Abstract:
To solve a matter that an electronic component is easily damaged by inflow pressure of resin when a one package module is made by molding, and to reduce damage on an electronic component package.
In a substrate for mounting an electronic component package where coating resin is provided on the mounting surface of the mounting substrate such that an electronic component is covered after it is mounted, a protrusion is provided on the outer circumference of the projection plane of the electronic component for the mounting substrate.
Inventors:
TAKANO ATSUSHI
Application Number:
JP2005319058A
Publication Date:
May 24, 2007
Filing Date:
November 02, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/28; H01L21/56
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano