Title:
基板の溝加工ツール及び溝加工装置
Document Type and Number:
Japanese Patent JP5826665
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable accurate grooving without adjusting a machining position, even when a tool has been replaced.SOLUTION: This grooving tool 2 is held by a holder 17, forms a groove in a machining object substrate by relatively moving the substrate together with the holder 17, and includes a tool body 36 and a cutting edge part 37. The tool body 36 has a contact surface 36a contacting the holder 17 and is held by the holder 17. The cutting edge part 37 is formed at an end of the tool body 36, has a reference plane 37a continuing from the contact surface 36a and formed flush with the contact surface 36a, and has a predetermined width from the reference plane 37a.
Inventors:
Masanobu Soyama
Application Number:
JP2012032895A
Publication Date:
December 02, 2015
Filing Date:
February 17, 2012
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23D13/00; B23D1/18; B23D7/06
Domestic Patent References:
| JP2010245255A | ||||
| JP2007203379A | ||||
| JP6295813U | ||||
| JP2003145321A |
Foreign References:
| CH247283A5 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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