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Patent Searching and Data


Title:
SUBSTRATE HAVING METALLIC FILM AND ITS MANUFACTURING METHOD, AND ELECTRONIC COMPONENT USING THE SUBSTRATE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2007077429
Kind Code:
A
Abstract:

To provide a substrate having a metallic film capable of enhancing adhesivity between the substrate and the metallic film, and its manufacturing method.

A unimolecular film 2 is deposited between a substrate 1 and a metallic film 5. The single molecule film 2 is firmly bonded with the substrate 1 via a siloxane bonding. Since the pyrrolyl group having strong affinity to a metal is bonded with the metallic film 5, the adhesiveness between the substrate 1 and the metallic film 5 becomes more excellent. In the present embodiment, the surface of the substrate 1 is not lugged, the metallic film 5 worked in, for example, a wiring pattern is subjected to microfabrication in a desired shape with high accuracy.


Inventors:
MIYAZAWA SATOSHI
OGAWA KAZUFUMI
Application Number:
JP2005264705A
Publication Date:
March 29, 2007
Filing Date:
September 13, 2005
Export Citation:
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Assignee:
ALPS ELECTRIC CO LTD
International Classes:
C23C18/18; B05D1/18; B05D3/10; B05D7/24; C23C18/31
Attorney, Agent or Firm:
野▲崎▼ 照夫
Masayoshi Miwa