Title:
SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
Japanese Patent JP2022045982
Kind Code:
A
Abstract:
To suppress deformation and deterioration of a chamber and improve stability at the time of substrate heating.SOLUTION: A substrate heating apparatus includes: a chamber inside which a storage space capable of storing a substrate is formed; a substrate heating unit that is disposed in the storage space and is capable of heating the substrate using infrared radiation; and a heat shield plate that is provided between the chamber's inner surface and the substrate heating unit, absorbs the infrared radiation, and has a thickness equal to or smaller than 1 mm.SELECTED DRAWING: Figure 2
Inventors:
KONDO SHIRO
KOBARI HITOSHI
KATO SHIGERU
NISHINOHARA TAKUMA
KOBARI HITOSHI
KATO SHIGERU
NISHINOHARA TAKUMA
Application Number:
JP2020151778A
Publication Date:
March 23, 2022
Filing Date:
September 10, 2020
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
H01L21/312; C08J7/00; F26B3/30; F26B9/06; H01L21/31; H05B3/10
Attorney, Agent or Firm:
Sumio Tanai
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida