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Title:
基板加熱装置、基板処理システム及び基板加熱方法
Document Type and Number:
Japanese Patent JP7018713
Kind Code:
B2
Abstract:
The present invention restrains attachment of a sublimate to an inner surface of a chamber. According to an embodiment, the substrate heating apparatus comprises: a chamber having a storage space therein to be capable of storing a substrate where solution is applied; a decompression unit capable of decompressing the atmosphere of the storage space; a substrate heating unit capable of heating the substrate while arranged on at least one side among one side or the other side of the substrate; and a chamber heating unit heating at least a portion of an inner surface of the chamber.

Inventors:
Shigeru Kato
Tsutomu Sabota
Kenichi Yamatani
Yoshiaki Masu
Application Number:
JP2017064404A
Publication Date:
February 14, 2022
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
F26B3/30; F26B13/02; F26B13/10; F26B23/04; F27B9/04; F27B9/36; F27D11/02; F27D17/00
Domestic Patent References:
JP2016055242A
JP2014199805A
JP2017053607A
JP2265675A
JP2004025274A
JP2015048974A
JP2011208825A
JP2003139470A
JP2009173969A
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida