To make duct interruption effect sufficient and to realize speedy switching in a substrate holding device where a substrate is sucked and held by negative pressure and is transported to a stage by a transport mechanism.

A wafer chuck 3 of the substrate holding device sucks and holds a wafer 2 as the substrate by negative pressure and is transported to the stage 4 by a transport mechanism 50. The chuck 3 is provided with a stage side duct 33a which sucks and holds the wafer 2 based on negative pressure and a negative pressure control signal which are supplied from the stage 4, and sucks the wafer 2 on the stage 4, when the wafer 2 is held on the stage 4. The chuck sucks and holds the wafer 2 based on negative pressure and the negative pressure control signal which are supplied from the transport mechanism 50, when the wafer is transported by the transport mechanism 50. The chuck sucks the wafer 2 on the stage 4 and with a transport mechanism side duct 33b for sucking the wafer 2 by the hand 51 of the transport mechanism 50.