Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE-HOLDING DEVICE, METHOD FOR MANUFACTURING THE SUBSTRATE-HOLDING DEVICE AND METHOD FOR RETAINING SUBSTRATE
Document Type and Number:
Japanese Patent JP2008078443
Kind Code:
A
Abstract:

To provide a substrate-holding device, a method for manufacturing the substrate-holding device and a method for retaining substrate, wherein the substrate can be reinforced and adverse effects on the substrate can be suppressed.

The substrate-holding device 12 is used for reinforcing the strength of a substrate 11, and is fixed to the substrate 11 by a negative pressure. The substrate-holding device 12 has a first holding device 16 and a second holding device 17, which are mutually bonded. The first holding device 16 has a substrate-chucking face 18 serving as a face adhered to the substrate 11, a channel 19 for removing a gas existing between the substrate 11 and the substrate-holding device 12, and a vacuum hole 20. The second holding device 17 has a valve 21, which is bonded to the first holding device 16 to circulate or shut off gas and to retain the substrate 11 by the substrate-holding device 12, and a protrusion which is formed so as to link with the valve 21, for assisting the opening and closing operation of the valve 21.


Inventors:
SHIMURA YASUTO
Application Number:
JP2006256870A
Publication Date:
April 03, 2008
Filing Date:
September 22, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/683; B23Q3/08; B24B41/06; B81C99/00
Attorney, Agent or Firm:
Masahiko Ueyanagi
Kazuhiko Miyasaka