Title:
基板液処理方法及び基板液処理装置
Document Type and Number:
Japanese Patent JP7203995
Kind Code:
B2
Abstract:
A substrate having a recess, a diffusion barrier layer defining the recess, and a wiring exposed at a bottom of the recess is prepared. A metal ion, having a concentration not causing precipitation of a metal even when an electroless plating liquid comes into contact therewith, is attached to the diffusion barrier layer. The metal is precipitated in the recess by supplying the electroless plating liquid into the recess in a state that the metal ion is attached to the diffusion barrier layer.
Inventors:
Mitsuaki Iwashita
Application Number:
JP2021548807A
Publication Date:
January 13, 2023
Filing Date:
September 14, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/288; H01L21/768
Domestic Patent References:
| JP2006513325A | ||||
| JP2002110784A | ||||
| JP200115517A | ||||
| JP201499627A | ||||
| JP2010503204A | ||||
| JP2014122391A |
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Hideyuki Mori
Taku Murakoshi
Miyajima Manabu
Hideyuki Mori
Taku Murakoshi