Title:
基板の製造方法および基板
Document Type and Number:
Japanese Patent JP5891693
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a simple substrate manufacturing method and a substrate obtained by the manufacturing method, which can more effectively avoid warp.SOLUTION: A substrate manufacturing method comprises in the following order: (a) a step of forming a first layer by using a film formation composition on a support medium, or forming the first layer by providing an adhesive layer on the support medium; (b) a step of providing a second layer on the first layer by film lamination or by using the film formation composition; (c) a step of curing the first layer and/or the second layer in the case of using the film formation composition in the step (a) and the step (b); (d) a step of forming an element on the second layer; and (e) a step of removing the support medium from a laminate in which the element is formed to obtain a substrate including at least the second layer on which the element is formed. The first layer and/or the second layer after the step (c) includes a polyimide derived from a polyimide precursor having a specific structural unit.
Inventors:
Nobuyuki Miyaki
Shintaro Fujitomi
Takafumi Shimizu
Okiwa
Yuya Nawa
Shintaro Fujitomi
Takafumi Shimizu
Okiwa
Yuya Nawa
Application Number:
JP2011221180A
Publication Date:
March 23, 2016
Filing Date:
October 05, 2011
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
H05K1/03; C08G73/10; H01L51/50; H05B33/02; H05B33/10
Domestic Patent References:
| JP2127430A | ||||
| JP2006182854A | ||||
| JP2007062274A | ||||
| JP2091125A | ||||
| JP4220430A | ||||
| JP2002012667A |
Foreign References:
| WO2011024690A1 | ||||
| WO2005061227A1 |
Attorney, Agent or Firm:
Patent corporation ssinpat