Title:
基板作製方法
Document Type and Number:
Japanese Patent JP5418923
Kind Code:
B2
Abstract:
A method of fabricating a substrate includes forming spaced first features and spaced second features over a substrate. The first and second features alternate with one another and are spaced relative one another. Width of the spaced second features is laterally trimmed to a greater degree than any lateral trimming of width of the spaced first features while laterally trimming width of the spaced second features. After laterally trimming of the second features, spacers are formed on sidewalls of the spaced first features and on sidewalls of the spaced second features. The spacers are of some different composition from that of the spaced first features and from that of the spaced second features. After forming the spacers, the spaced first features and the spaced second features are removed from the substrate. The substrate is processed through a mask pattern comprising the spacers. Other embodiments are disclosed.
Inventors:
Sills, Scott E.
Sandu, Ghat S.
De Villiers, Anton Jay.
Sandu, Ghat S.
De Villiers, Anton Jay.
Application Number:
JP2011539550A
Publication Date:
February 19, 2014
Filing Date:
November 11, 2009
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/027; H01L21/3065
Domestic Patent References:
| JP2007305976A | ||||
| JP64035916A | ||||
| JP2008072101A | ||||
| JP2006261307A | ||||
| JP7326562A | ||||
| JP2007017993A |
Attorney, Agent or Firm:
Nomura Yasuhisa
Yoshiyuki Osuga
Yoshiyuki Osuga