Title:
基材の製造方法
Document Type and Number:
Japanese Patent JP7088658
Kind Code:
B2
Abstract:
To provide a method for producing a base material, in spite of the depth of the recessed part of a base material, capable of suppressing the generation of molding defects such as cracks in its surface.SOLUTION: Provided is a method for producing a base material 1 in which a recessed part 12 is formed on the surface. The method for producing a base material 1 comprises: a pre-molding step where a pre-recessed part 22 shallower than the recessed part 12 is formed on the surface of an uncured base material 2; and a normal molding step where the position of the pre-recessed part 22 is pressed to form the recessed part 12.SELECTED DRAWING: Figure 4
Inventors:
Kazuhiro Mashima
Mihiro Morikawa
Koji Kobayashi
Mihiro Morikawa
Koji Kobayashi
Application Number:
JP2017207493A
Publication Date:
June 21, 2022
Filing Date:
October 26, 2017
Export Citation:
Assignee:
KMEW Co., Ltd.
International Classes:
B28B11/10
Domestic Patent References:
| JP2004276315A | ||||
| JP11099509A | ||||
| JP63109006A | ||||
| JP2016185676A | ||||
| JP2003181821A | ||||
| JP62099111A |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office