Title:
電子部品搭載用基板及びその製造方法
Document Type and Number:
Japanese Patent JP7048593
Kind Code:
B2
Abstract:
This board has an insulation layer 11, and a conductor 12 that is provided to the insulation layer 11. At least one section of a bottom surface and a side surface of the conductor 12 is positioned further to a back surface side than a front surface of the insulation layer 11.
Inventors:
Veggie Sasaki
Application Number:
JP2019519175A
Publication Date:
April 05, 2022
Filing Date:
May 02, 2018
Export Citation:
Assignee:
Veggie Sasaki
International Classes:
H05K3/22; H01L23/12; H05K3/38
Domestic Patent References:
| JP2011014644A | ||||
| JP9148733A | ||||
| JP2015122386A | ||||
| JP2003273509A |
Attorney, Agent or Firm:
Seiji Ohno
Hiroyuki Ohno
Hiroyuki Ohno
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