Title:
SUBSTRATE PLATING APPARATUS
Document Type and Number:
Japanese Patent JP3654840
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate plating apparatus which can prevent the contamination of a masking member and can realize miniaturization of the apparatus by preventing the spread of a plating liquid over the entire masking member.
SOLUTION: In a substrate plating apparatus which performs plating processing by discharging a plating liquid L to a recovery tank 27 in a state a substrate W is masked with a masking member 3 and the processing surface Ws of the substrate W is brought into contact with the plating liquid, the masking member 3 is provided with a projecting part 3d at a location between a plating bath 17 and a recovery tank 19 at its under surface. Since the projecting part 3d provided on the under surface of the masking member 3 prevents the spread of the plating liquid L, the whole under surface of the masking member 3 is prevented from being polluted with the plating liquid L. Furthermore, since the diameter of the recovery tank 19 can be made smaller than the diameter of the masking member 3, the whole apparatus can be miniaturized.
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Inventors:
Hiroshi Mizohata
Application Number:
JP2001007781A
Publication Date:
June 02, 2005
Filing Date:
January 16, 2001
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
C25D17/00; C25D17/06; (IPC1-7): C25D17/00; C25D17/06
Domestic Patent References:
| JP2061089A | ||||
| JP7211724A | ||||
| JP2217429A | ||||
| JP5243235A |
Attorney, Agent or Firm:
Tsutomu Sugiya