Title:
SUBSTRATE POLISHING APPARATUS AND ITS POLISHING PROCESS
Document Type and Number:
Japanese Patent JPH0957611
Kind Code:
A
Abstract:
To make a polishing pad surface flat without carrying out dressing.
Liqid thermoplastic resin is supplied onto the surface of a table 31 from the first tubing 32 disposed in the upper portion of the rotable table 31 comprised of a rigid body, spreaded by surface tension, and heated by a heating lamp 34 to cure, so that a polishing resin film 33 having a flat and smooth surface is formed on the table 31. Dripping an abrasive solution on a polishing resin film 33 from the second tubing 37 disposed in the upper portion of the table 31, a substrate 35 is polished. The worn polishing resin film 33 can be disolved to remove by supplying a solvent from a third tube 38 disposed in the upper portion of the table 31.
Inventors:
NISHIO MIKIO
Application Number:
JP2886496A
Publication Date:
March 04, 1997
Filing Date:
February 16, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B24B37/12; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JPH07263385A | 1995-10-13 | |||
| JPH0649158A | 1994-02-22 |
Attorney, Agent or Firm:
Hiroshi Maeda (1 person outside)