SUBSTRATE POLISHING APPARATUS

Title:

SUBSTRATE POLISHING APPARATUS

Document Type and Number:

Japanese Patent JP2023124820

Kind Code:

A

Abstract:

To provide a substrate polishing apparatus that can reduce overall processing time when performing multiple types of polishing.SOLUTION: A substrate polishing apparatus comprises a first polishing module, a second polishing module, and a third polishing module, and the first polishing module, the second polishing module, and the third polishing module are polishing modules that polish different respective areas of the substrate.SELECTED DRAWING: Figure 1

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Inventors:

TANIZAWA AKIHIRO
KOBAYASHI KENICHI
OHASHI HIROAKI
ISHIKAWA SHO
KASHIWAGI MAKOTO
MIYAZAWA YASUYUKI

Application Number:

JP2023017612A

Publication Date:

September 06, 2023

Filing Date:

February 08, 2023

Export Citation:

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Assignee:

EBARA CORP

International Classes:

H01L21/304; B24B9/00; B24B19/08; B24B21/00; B24B37/10; B24B49/10

Attorney, Agent or Firm:

Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa

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