Title:
基板研磨方法及びその装置
Document Type and Number:
Japanese Patent JP5464497
Kind Code:
B2
Abstract:
A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.
Inventors:
Hosokai Nobuwa
Oguro Isamu
Atsushi Watanabe
Tetsujiro Tada
Oguro Isamu
Atsushi Watanabe
Tetsujiro Tada
Application Number:
JP2010184018A
Publication Date:
April 09, 2014
Filing Date:
August 19, 2010
Export Citation:
Assignee:
Sanshin Co., Ltd.
mipox corporation
mipox corporation
International Classes:
B24B21/00; B24B1/00; B24B9/00; G11B5/84
Domestic Patent References:
| JP2002219642A | ||||
| JP9277150A | ||||
| JP1199458A | ||||
| JP2003117795A | ||||
| JP2002126981A | ||||
| JP3173144B2 | ||||
| JP5314474A |
Attorney, Agent or Firm:
Yuji Kuroda