Title:
SUBSTRATE POLISHING METHOD
Document Type and Number:
Japanese Patent JPH08148454
Kind Code:
A
Abstract:
PURPOSE: To provide a polishing method with which a polishing liquid can be spread to the center part of the surface to be polished when a substrate is polished using a polishing liquid, and the whole surface of the substrate can be polished excellently and uniformly.
CONSTITUTION: When the surface 2 to be polished of the substrate 1 (semiconductor wafer, etc.) is polished using a polishing liquid, grooves 3, to be used for feeding of the polishing liquid to reach the center part of the surface 2 to be polished of the substrate, are formed on the surface 2 to be polished, on scribe lines, for example, and a polishing operation is conducted.
More Like This:
Inventors:
NAGANO TAKASHI
Application Number:
JP28775694A
Publication Date:
June 07, 1996
Filing Date:
November 22, 1994
Export Citation:
Assignee:
SONY CORP
International Classes:
B24B37/00; B24B37/04; H01L21/02; H01L21/301; H01L21/304; H01L27/12; (IPC1-7): H01L21/304; B24B37/04; H01L21/02; H01L21/301; H01L27/12
Attorney, Agent or Firm:
Toru Takatsuki
Previous Patent: SUBSTRATE SURFACE PROTECTING TAPE AND SUBSTRATE BACKSIDE GRINDING METHOD
Next Patent: SURFACE FLATTENING METHOD FOR THIN FILM
Next Patent: SURFACE FLATTENING METHOD FOR THIN FILM