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Title:
SUBSTRATE POSITION CORRECTING METHOD
Document Type and Number:
Japanese Patent JPS6427822
Kind Code:
A
Abstract:

PURPOSE: To enable arbitrary selection of a set position and to permit high- reliable correction of a position, by a method wherein recognition marks are set in the vicinity of a part mounting position on a substrate, and through detection of the recognition mark, the detecting result causes correction of the position of the substrate.

CONSTITUTION: A pair of recognition marks 18 and 18 for correcting the whole of a substrate are set at the corner parts at both ends of a substrate 11. Since displacement in a pattern normally frequency occurs at a part A, a pair of recognition marks 19 and 19 are set in the vicinity of parts 14 and 15, intended to be mounted to the part A, independently from the recognition marks 18. In mounting of the parts, the position of the whole of the substrate 11 is corrected by means of the recognition marks 18 and 18 to mount the parts 16 and 17. In relation with the part A, through utilization of the recognition marks 19 and 19, further independent correction of a position is effected to mount the parts 14 and 15. After completion of independent correction, parts 12 and 13 are mounted based on the result of recorrection of the position as a whole.


Inventors:
TANAKA SUEHIRO
SASAKI HIDETOSHI
HOSOKAWA KENJI
Application Number:
JP18449187A
Publication Date:
January 30, 1989
Filing Date:
July 23, 1987
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23P19/00; H05K13/04; H05K1/02; H05K3/30; (IPC1-7): B23P19/00; H05K13/04
Domestic Patent References:
JPS57189736A1982-11-22
JPS59133113A1984-07-31
JPS62130596A1987-06-12
Attorney, Agent or Firm:
Yoshihiro Morimoto



 
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