Title:
基板処理装置及びこれに提供されるフィラー部材
Document Type and Number:
Japanese Patent JP7270713
Kind Code:
B2
Abstract:
An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.
Inventors:
Jae, Jinmo
Oh, shit
Choi, Young Sop
Park, Miso
U, Jonghyun
Oh, shit
Choi, Young Sop
Park, Miso
U, Jonghyun
Application Number:
JP2021200448A
Publication Date:
May 10, 2023
Filing Date:
December 09, 2021
Export Citation:
Assignee:
Cemes Company, Limited
International Classes:
H01L21/304
Domestic Patent References:
| JP2013120944A | ||||
| JP2013033962A | ||||
| JP2014175669A | ||||
| JP2018207103A |
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi
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