Title:
基板処理装置および基板処理装置の運転方法
Document Type and Number:
Japanese Patent JP7189013
Kind Code:
B2
Abstract:
A plasma processing apparatus includes a storage; processors; a liquid supply which supplies, into the storage, at least a first liquid composed of a processing liquid or source liquids for composing the processing liquid; a detector which detects a value of a parameter indicating a state of the first liquid supplied into the storage or a state of the processing liquid in the storage; and a controller which controls the processors to perform a liquid processing in sequence. The controller determines, based on a detection result of the value of the parameter, whether it is possible to supply the processing liquid continuously into a preset number of processors concurrently under a condition requested by the processors, and, if not, the controller performs a simultaneous processing restricting control of reducing a number of processors which are supposed to perform the liquid processing concurrently to be lower than the preset number.
Inventors:
Maezono Tomiyasu
Sadamichi Mori
Takuma Takuma
Power of Nobukuni
Keigo Satake
Shinji Sugawara
Masahiro Yoshida
Sadamichi Mori
Takuma Takuma
Power of Nobukuni
Keigo Satake
Shinji Sugawara
Masahiro Yoshida
Application Number:
JP2018248011A
Publication Date:
December 13, 2022
Filing Date:
December 28, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; H01L21/677
Domestic Patent References:
| JP2017011159A | ||||
| JP2010232520A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Nakamura Yukitaka
Yasukazu Sato
Satoru Asakura
Hideyuki Mori
Nakamura Yukitaka
Yasukazu Sato
Satoru Asakura
Hideyuki Mori