Title:
基板処理装置、基板を処理する方法及び処理加工物を製造する方法
Document Type and Number:
Japanese Patent JP7282769
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a base with a process-side surface and a substrate support arranged on the process-side surface and designed to carry a substrate at its periphery. The periphery, more specifically the plane defined by the periphery, is spaced apart from the process-side surface. The substrate processing apparatus also includes a radiation sensor adapted to measure electromagnetic radiation arranged on a side of a back-side surface of the base. A radiation channel is arranged between the radiation sensor and the periphery of the substrate support, more specifically between the radiation sensor and the plane defined by the periphery, wherein the radiation channel is at least partially permeable to electromagnetic radiation.
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Inventors:
Hartmut Roaman
Heinz Feltzer
Dominic Jaeger
Hubert brois
Heinz Feltzer
Dominic Jaeger
Hubert brois
Application Number:
JP2020528861A
Publication Date:
May 29, 2023
Filing Date:
November 27, 2018
Export Citation:
Assignee:
Evatech AG
International Classes:
H01L21/683; C23C14/50; C23C14/52; C23C16/46
Domestic Patent References:
| JP2006512590A | ||||
| JP4297054A | ||||
| JP2004363623A | ||||
| JP2017527987A | ||||
| JP2001148371A | ||||
| JP2005501407A | ||||
| JP8162415A |
Foreign References:
| US20130157460 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe