Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, PROGRAM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022132676
Kind Code:
A
Abstract:
To provide a technique capable of suppressing the occurrence of particles by removing by-products.SOLUTION: A substrate processing apparatus includes a processing container processing a substrate, and a substrate supporting section provided in the processing container and having a plurality of mounting parts on which the substrate is mounted. The processing container has a processing area where process gas is supplied on the substrate and a purge area where the substrate is purged. The purge area has a first purge area having a ceiling lower than the ceiling of the processing area, provided on the ceiling and purged at first pressure, and a second purge area provided on the ceiling and purged at second pressure, the ceiling height in the first purge area being configured to be lower than the ceiling height in the second purge area.SELECTED DRAWING: Figure 1
Inventors:
Naofumi Ohashi
Tetsuaki Inada
Tetsuaki Inada
Application Number:
JP2022104996A
Publication Date:
September 09, 2022
Filing Date:
June 29, 2022
Export Citation:
Assignee:
KOKUSAI ELECTRIC Inc.
International Classes:
H01L21/31; C23C16/44
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office