Title:
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2023067802
Kind Code:
A
Abstract:
To provide a substrate treating apparatus and a substrate treating method having improved efficiency and productivity.SOLUTION: The substrate treating apparatus includes: a stage 110 extending in a first direction, for moving a substrate 150 in the first direction, the stage 110 having an air floating system; a gantry 200 arranged on the stage 110 to extend in a second direction crossing the first direction; a head module 300 installed on the gantry 200 and movable in the second direction; and a displacement sensor installed in the head module 300, for measuring a separation distance between the substrate 150 and stage 110. At each of the first position and the second position, the displacement sensor when the head module 300 ejects an ink to the substrate measures the separation distance between the substrate 150 and the stage 110.SELECTED DRAWING: Figure 1
Inventors:
LEE DONG YUN
Application Number:
JP2022169624A
Publication Date:
May 16, 2023
Filing Date:
October 24, 2022
Export Citation:
Assignee:
SEMES CO LTD
International Classes:
H05K3/10
Domestic Patent References:
| JP2006210393A | 2006-08-10 | |||
| JP2010232472A | 2010-10-14 | |||
| JP2014183243A | 2014-09-29 |
Attorney, Agent or Firm:
IBC Ichibancho Patent Attorney Corporation
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