To provide a substrate processing apparatus and a substrate processing method, capable of detecting protrusion of a wafer at a ring boat and protrusion of a ring-like plate.
Protrusion detecting means, which detects protrusion of a substrate 12 and a substrate support part 70 respectively from a specified position of a substrate support body, includes a first protrusion detection sensor 92, a second protrusion detection sensor 94, a protrusion detection sensor supporting part which supports the first protrusion detection sensor 92 and the second protrusion detection sensor 94, and moving means which moves the protrusion detection sensor support part toward the placement position of the substrate 12 or the substrate support part 70. The second protrusion detection sensor 94 is positioned farther away from the substrate support part than the first protrusion detection sensor 92, being provided in front of the front side, in moving direction, of the protrusion detection sensor support part at the position where the first protrusion detection sensor 92 is provided.
JP2004119835 | DEVICE FOR DETECTING THIN SUBSTRATE |
TEZUKA SHIGENORI
YOSHIDA AKIHIRO
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