Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2016201535
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of aligning the center of a substrate such as a wafer to a shaft center of a substrate stage with high accuracy.SOLUTION: A substrate processing apparatus comprises: an eccentricity detection part 60 for acquiring an eccentricity amount and an eccentricity direction with respect to the shaft center C1 of a centering stage 10 at the center of a substrate W; and aligners 36, 41, 75 for performing a centering operation to transfer and rotate the centering stage 10 until the center of the substrate W on the centering stage 10 is located on the shaft center C2 of a process stage 20. The aligners 36, 41, 75 calculate a distance of transferring the centering stage 10 and an angle of rotating the centering stage 10 based on an initial relative position of the shaft center of the centering stage 10 with respect to the shaft center of the process stage 20, and the eccentricity amount and the eccentricity direction of the center of the substrate W.SELECTED DRAWING: Figure 1
Inventors:
ISHII YU
DU FENG JIE
KASHIWAGI MAKOTO
DU FENG JIE
KASHIWAGI MAKOTO
Application Number:
JP2016034548A
Publication Date:
December 01, 2016
Filing Date:
February 25, 2016
Export Citation:
Assignee:
EBARA CORP
International Classes:
H01L21/68; B24B49/02; B24B49/12; H01L21/304; H01L21/683
Domestic Patent References:
| JP2015074071A | 2015-04-20 | |||
| JP2010247273A | 2010-11-04 | |||
| JPH10223727A | 1998-08-21 | |||
| JP2001057380A | 2001-02-27 | |||
| JP2003152051A | 2003-05-23 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa
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