Title:
SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023042561
Kind Code:
A
Abstract:
To provide a substrate processing apparatus capable of improving the flatness of the surface of a laminated substrate after the substrate is thinned.SOLUTION: A substrate processing apparatus comprises: a filler application module 300 which applies a filler F to a gap between the peripheral edges of adjacent wafers W1 and W2 in a laminated substrate Ws and cures the applied filler F; a grinding module 400 which grinds the upper surface of the laminated substrate Ws to which the filler F has been applied; and a polishing module 500 which polishes the top surface of the ground laminated substrate Ws.SELECTED DRAWING: Figure 1
Inventors:
SATAKE MASAYUKI
NAKANISHI MASAYUKI
MITSUKI YUTA
NAKANISHI MASAYUKI
MITSUKI YUTA
Application Number:
JP2022108478A
Publication Date:
March 27, 2023
Filing Date:
July 05, 2022
Export Citation:
Assignee:
EBARA CORP
International Classes:
H01L21/304; B24B7/22; B24B9/00; B24B21/00; B24B29/00; B24B37/00; H01L21/677
Attorney, Agent or Firm:
Tetsuya Hirosawa
Yutaro Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Yutaro Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Previous Patent: JPWO2023042560
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