Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023103649
Kind Code:
A
Abstract:
To provide a vertical-transportation, inter-back substrate processing device, enabling reduction in particles attached to a substrate and a carrier.SOLUTION: A substrate processing device 100 includes vacuum chambers 101-105 for subjecting a substrate S held by a carrier 10 to vacuum treatment, a vertical-transportation mechanism 110 for transporting the substrate and the carrier in standing posture, and a particle removal mechanism 120 for removing particles attached to the substrate and the carrier. The particle removal mechanism includes a jet nozzle 121 for blowing air toward the carrier and the substrate transported by the vertical-transportation mechanism and a suction nozzle 122 for sucking the air blown to the carrier and the substrate.SELECTED DRAWING: Figure 1
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Inventors:
HASHIMOTO MICHIHITO
ONO TETSUHIRO
ONO TETSUHIRO
Application Number:
JP2022004287A
Publication Date:
July 27, 2023
Filing Date:
January 14, 2022
Export Citation:
Assignee:
ULVAC CORP
International Classes:
C23C14/02; C23C14/56; C23C16/54; H01L21/677; H05B33/10; H10K50/10
Attorney, Agent or Firm:
Shu Oikawa
Tomoo Katsumata
Tomoo Katsumata