Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP3917493
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent variations in width of a region to which treatment with a treatment solution is carried out.
SOLUTION: The substrate processing apparatus includes a spin chuck 1 for holding a wafer W almost horizontally and rotating the wafer W, a blocking member 2 provided near to an upper face of the wafer W held by the spin chuck 1, and a nozzle 3 for feeding an etching solution onto an upper face 23 of the blocking member 2. The blocking member 2 has a lower face 21 of a round shape a little smaller than the outer shape of the wafer W, a side face 22 rising almost upright from the periphery of the lower face 21, and a conical upper face 23 slanted nearer to the axial line passing through the center of the lower face 21 sequentially as it comes upward from the upper edge of the side face 22. The lower face 21 of the blocking member 2 has a hydrophobic face with hydrophobicity, which the side face 22 and the upper face 23 of the blocking member 2 has a hydrophilic face with hydrophilicity.
Inventors:
Hiroyuki Araki
Application Number:
JP2002283458A
Publication Date:
May 23, 2007
Filing Date:
September 27, 2002
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B05D1/40; H01L21/306; B05C11/08; H01L21/027; H01L21/3213; (IPC1-7): H01L21/306; B05C11/08; B05D1/40; H01L21/027; H01L21/3213
Domestic Patent References:
| JP2002075953A | ||||
| JP2002075956A |
Attorney, Agent or Firm:
Mio Kawasaki
Inaoka cultivation
Inaoka cultivation
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