Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7137408
Kind Code:
B2
Abstract:
To provide a substrate processing apparatus and a substrate processing method capable of improving productivity.SOLUTION: A substrate processing apparatus includes a buffer unit 14 functioning as a delivery table having first and second tables 14a1, 14a2 for supporting a substrate W individually, and a second transfer robot 15 having a hand 31 for holding the substrate W, and functioning as a transportation part for transferring the substrate W from the buffer unit 14. The buffer unit 14 is formed so that the hand 31 moves downward from an upper position toward a lower position of the first table 14a1 and places the substrate W thereon, the hand 31 moved to the lower position of the first table 14a1 moves crosswise from the lower position of the first table 14a1 to a lower position of the second table 14a2, and the hand 31 moved to the lower position of the second table 14a2 moves upward from the lower position toward the upper position thereof, and lifts the substrate W from the second table 14a2.SELECTED DRAWING: Figure 3
Inventors:
Furuya Masaaki
Hideki Mori
Hideki Mori
Application Number:
JP2018166333A
Publication Date:
September 14, 2022
Filing Date:
September 05, 2018
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/677; H01L21/027; H01L21/304
Domestic Patent References:
| JP201769548A | ||||
| JP201769315A | ||||
| JP201154916A | ||||
| JP2017199735A |
Attorney, Agent or Firm:
Mitsuharu Kiuchi
Koichi Okuma
Sadanori Katagiri
Kanako Kiuchi
Misawa patent office
Koichi Okuma
Sadanori Katagiri
Kanako Kiuchi
Misawa patent office