Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7220537
Kind Code:
B2
Abstract:
The substrate processing apparatus includes: a nozzle having a spout and adapted to spout SPM from the spout toward a substrate; a mixing portion communicating with the spout; a sulfuric acid-containing liquid supply device which recovers liquid supplied to and expelled from the substrate held by a substrate holding unit, prepares a sulfuric acid-containing liquid from the recovered liquid, and supplies the prepared sulfuric acid-containing liquid to the mixing portion; and a control device. The control device performs: a sulfuric acid-containing liquid preparing step of recovering SPM supplied to and expelled from the substrate and preparing the sulfuric acid-containing liquid; and an SPM spouting step of supplying the prepared sulfuric acid-containing liquid and hydrogen peroxide water to the mixing portion, mixing the sulfuric acid-containing liquid and hydrogen peroxide water together in the mixing portion to prepare SPM, and spouting the prepared SPM from the spout.
Inventors:
Kenji Kawaguchi
Tohru Endo
Kota Tanikawa
Tohru Endo
Kota Tanikawa
Application Number:
JP2018176394A
Publication Date:
February 10, 2023
Filing Date:
September 20, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; H01L21/304; H01L21/306
Domestic Patent References:
| JP2008095144A | ||||
| JP2013021198A | ||||
| JP2010010422A | ||||
| JP2013074090A | ||||
| JP2016072613A | ||||
| JP2018056293A |
Foreign References:
| WO2017135064A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Ai Patent Office
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