Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND DATA PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022162709
Kind Code:
A
Abstract:
To provide a substrate processing device, a substrate processing system, and a data processing method that can guarantee the reliability of a processing condition output from a learned model.SOLUTION: A substrate processing device 100 includes a thickness measurement unit 8, a control unit 102, and a storage unit 103. The thickness measurement unit 8 measures the thickness of a target object TG included in a substrate W. Due to input of input data to a learned model LM, the control unit 102 causes a processing condition to be output from the learned model. The storage unit 103 stores reference data RE obtained on the basis of a plurality of pieces of learning data LD used to build the trained model LM. The control unit 102 acquires pre-processing measurement data indicating the thickness of the target object TG before executing substrate processing, and generates input data on the basis of the target data indicating the target value of the thickness of the target object TG and the pre-processing measurement data. The control unit 102 compares the input data with the reference data RE to determine whether to perform substrate processing.SELECTED DRAWING: Figure 12
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Inventors:
OTA TAKASHI
NAOHARA EIJI
IKEUCHI TAKASHI
HIRAOKA TETSUYA
NAOHARA EIJI
IKEUCHI TAKASHI
HIRAOKA TETSUYA
Application Number:
JP2021067672A
Publication Date:
October 25, 2022
Filing Date:
April 13, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/306
Attorney, Agent or Firm:
Hiroyuki Maei
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