Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2005251988
Kind Code:
A
Abstract:
To improve maintenance work efficiency and operation coefficient of a substrate processing apparatus by easily removing a reaction byproduct deposited on an exhaust pipe and thereby remarkably alleviating the maintenance work.
The manufacturing method of semiconductor device is provided with a function to remove a deposition 48 adhered to the pipe wall by providing a deposition removing body 43 which can shift within a pipe 27, and by shifting the deposition removing body within the pipe.
Inventors:
TAKEBAYASHI MOTONARI
Application Number:
JP2004060547A
Publication Date:
September 15, 2005
Filing Date:
March 04, 2004
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC
International Classes:
C23C16/44; H01L21/22; H01L21/31; H01L21/324; (IPC1-7): H01L21/31; C23C16/44; H01L21/22; H01L21/324
Attorney, Agent or Firm:
Shoji Miyoshi
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