Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2014123713
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent mist of process liquid dispersed from a wafer from returning to the wafer.SOLUTION: A substrate processing apparatus includes a rotation cup (20) surrounding a substrate (W) held by a substrate holding part (10) and rotating along with the substrate holding part, for guiding a processing liquid dispersed from the rotating substrate, and a non-rotating outer cup (31) provided so as to surround the rotation cup via a gap, and having an inner space for receiving the processing liquid guided by the rotation cup. The height of the upper edge of the rotation cup is higher than the height of the upper edge of the outer cup, and the upper edge of the outer peripheral surface of the rotation cup is provided with an outside projection (20c) projecting outward in a radial direction of the rotation cup and extending in a circumferential direction thereof. The outside projection blocks mist of the processing liquid jumping out from the gap between the rotation cup (20) and the outer cup toward above the substrate.
Inventors:
AIURA KAZUHIRO
ITO KIKO
NAKAO HIDETOSHI
SHINOHARA KAZUYOSHI
TANAKA AKIRA
YOSHIDA YUKI
AIHARA AKINORI
ITO KIKO
NAKAO HIDETOSHI
SHINOHARA KAZUYOSHI
TANAKA AKIRA
YOSHIDA YUKI
AIHARA AKINORI
Application Number:
JP2013205418A
Publication Date:
July 03, 2014
Filing Date:
September 30, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/304; H01L21/306
Domestic Patent References:
| JP2012129462A | 2012-07-05 | |||
| JP2011507237A | 2011-03-03 | |||
| JP2003174005A | 2003-06-20 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Hideyuki Mori
Hiroyuki Nagai
Hideyuki Mori
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