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Title:
基板処理制御方法、基板処理装置、及び記憶媒体
Document Type and Number:
Japanese Patent JP7450358
Kind Code:
B2
Abstract:
A substrate processing control method in a substrate processing apparatus, includes: acquiring a data set for each substrate sequentially subjected to first and second processes at first and second levels, the data set including information specifying the first level at which the first process has been performed, information specifying the second level at which the second process has been performed and information about a characteristic amount relating to characteristics of the substrate; calculating information including an expected value of the characteristic amount, and level deviations of the first and second levels to the expected value based on the data set, and correcting the first parameter at the first level or the second parameter at the second level based on the calculated information.

Inventors:
▲鶴▼田 豊久
Yoshinori Konishi
Application Number:
JP2019174088A
Publication Date:
March 15, 2024
Filing Date:
September 25, 2019
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05C11/10; B05D1/40; B05D3/00
Domestic Patent References:
JP2008300777A
JP2004031921A
JP2009021443A
JP2009200354A
JP2016528741A
JP2005026362A
Foreign References:
WO2018142840A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo