Title:
基板処理装置及びその排気方法
Document Type and Number:
Japanese Patent JP7036642
Kind Code:
B2
Abstract:
Disclosed is a substrate treating apparatus with a baking unit for heating a substrate to which a treating liquid that generates sublimate through heating is applied to bake a surface of the substrate to form a coat film. The apparatus includes the following elements: a first bake group, a second bake group, a first exhaust pipe that forms a flow path of exhaust gases from the first bake group with its end being in fluid communication with an exhaust gas processor that processes the exhaust gases, a second exhaust pipe that forms a flow path of exhaust gases from the second bake group, and a junction provided at a midstream of the first exhaust pipe and in fluid communication with a downstream side of the second exhaust pipe.
Inventors:
Yasuhiro Shiba
Liu Ice Shio
Liu Ice Shio
Application Number:
JP2018056648A
Publication Date:
March 15, 2022
Filing Date:
March 23, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
B05C9/14; H01L21/027; G03F7/16
Domestic Patent References:
| JP2011044662A | ||||
| JP2002064044A | ||||
| JP2016115919A |
Foreign References:
| KR1020170078185A |
Attorney, Agent or Firm:
Tsutomu Sugitani
Hiroyuki Todaka
Tomohiko Sugiya
Kurihara Kaname
Nobuyoshi Aono
Hiroyuki Todaka
Tomohiko Sugiya
Kurihara Kaname
Nobuyoshi Aono