SUBSTRATE PROCESSING APPARATUS

Japanese Patent JP2018006549

A

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving a through-put.SOLUTION: A substrate processing apparatus comprises: a polishing part that polishes a substrate; a conveying part that conveys the substrate before the polishing to the polishing part; and a cleaning part that cleans the substrate after the polishing. The cleaning part includes a first cleaning unit and a second cleaning unit arranged at two stages in a vertical direction. Each of the first cleaning unit and the second cleaning unit includes a plurality of cleaning modules arranged in a serial line. The conveying part is arranged between the first cleaning unit and the second cleaning unit, and includes a slide stage conveying the substrate before the polishing along an arrangement direction of the plurality of cleaning modules.SELECTED DRAWING: Figure 1

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AONO HIROSHI
YAMAGUCHI KUNIAKI
SHIMOMOTO HIROSHI
MAEDA KOJI
YASHIMA TETSUYA
SHINKAI TAKESHI
HASHIMOTO KOICHI
INABA MITSUHIKO
ISOKAWA HIDETATSU
NAKAO HIDETAKA
ISOBE SOICHI

JP2016130900A

January 11, 2018

June 30, 2016

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EBARA CORP

H01L21/304; B24B37/34; H01L21/677

JP2008294233A	2008-12-04
JPH08162514A	1996-06-21
JP2008091920A	2008-04-17
JPH10284457A	1998-10-23
JP2016201399A	2016-12-01
JP2010050436A	2010-03-04
JP2015207602A	2015-11-19
JP2003309089A	2003-10-31

Seiji Ohno
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Tsukuda Seigen
Hiroshi Nomoto

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