Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP3153372
Kind Code:
B2
Abstract:
PURPOSE: To provide a substrate processing device, where a substrate and a circuit pattern formed out its surface are protected against damage or a substrate is prevented from getting out of position when the substrate on a mounting table is lifted up with a substrate support pin, and a heating process can be improved in flexibility.
CONSTITUTION: Through-holes 5 are provided to a hot plate 4, and a substrate support pin 6 is arranged in each through-hole 5. The lower end of the substrate support pin 6 is fixed to a connecting guide 7, and the connecting guide 7 is joined to a belt 8. The belt 8 is wound on a pulley 10 fitted to a stepping motor 9 and a pulley 11 located above the pulley 10, and the substrate support pins 6 are made to move up or down in accordance with the rotation of the stepping motor 9. The stepping motor 9 is controlled by a control device 12 to start, stop, or be regulated in rotary speed.
Inventors:
Sato, Takazo
Nonaka, Hiroshi
Takamori, Hideyuki
Anai, Noriyuki
Tagami, Koichi
Kitamura, Shinji
Tomoe, Takayuki
Iwasaki, Tatsuya
Mizosaki, Kengo
Nonaka, Hiroshi
Takamori, Hideyuki
Anai, Noriyuki
Tagami, Koichi
Kitamura, Shinji
Tomoe, Takayuki
Iwasaki, Tatsuya
Mizosaki, Kengo
Application Number:
JP2405093A
Publication Date:
April 09, 2001
Filing Date:
February 12, 1993
Export Citation:
Assignee:
TOKYO ELECTRON LTD
TOKYO ELECTRON KYUSHU KK
TOKYO ELECTRON KYUSHU KK
International Classes:
G02F1/13; G03F1/00; G03F1/68; G03F7/26; H01L21/027; H01L21/68; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
須山 佐一