Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP3910054
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing device wherein an air superior in uniformity of temperature distribution is supplied to a substrate processing part for processing a substrate.
SOLUTION: A resist coating unit (COT) is provided with a coater cup (CP) surrounding a wafer W held by a spin chuck 52, and an air supply mechanism for blowing within the coater cup (CP). The air supply mechanism is provided with a hollow frame 31a where a first window 34a is provided on a tube wall part 34, a blower for feeding air into the frame 31a, and a filter chamber unit (FCU) where air within the frame 31a is taken in. The filter chamber unit (FCU) is provided with a first air introduction chamber 91 provided with a heater 35, a second air introduction chamber 92, an air stream control mechanism 93, and a filter unit 94. A first wall 36 opposite to the tube wall 34 is provided in the first air introduction chamber 91 to allow an air taken in from the first window 34a to hit against the first wall 36, and a second window 36a is provided to the first wall 36 to allow an air heated by the heater 35 to flow into the second air introduction chamber 92. Thus, the uniformity of temperature distribution of air fed to the coater cup can be improved.
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Inventors:
Kanagawa Kozo
Application Number:
JP2001375718A
Publication Date:
April 25, 2007
Filing Date:
December 10, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B05C11/08; H01L21/027; G03F7/16; G03F7/30; H01L21/00; (IPC1-7): H01L21/027; B05C11/08
Domestic Patent References:
| JP2001118790A | ||||
| JP2001057335A | ||||
| JP2000150335A |
Attorney, Agent or Firm:
Hiroshi Takayama
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