Title:
Board processing equipment
Document Type and Number:
Japanese Patent JP6346286
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a sputter chamber, two targets located in the sputter chamber to form thin films on two film formation surfaces of a substrate through sputtering, and a transport mechanism that transports the substrate along a transport passage located in the sputter chamber. One of the two targets is located at one side of the transport passage opposed to one of the two film formation surfaces of the substrate at a front side with respect to a direction in which the substrate is transported. Another one of the two targets is located at another side of the transport passage opposed to another one of the two film formation surfaces of the substrate at a rear side with respect to the direction in which the substrate is transported.
Inventors:
Fujinaga Tetsushi
Atsuhito Ibori
Masahiro Matsumoto
Noriaki Tani
Harunori Iwai
Atsuhito Ibori
Masahiro Matsumoto
Noriaki Tani
Harunori Iwai
Application Number:
JP2016538297A
Publication Date:
June 20, 2018
Filing Date:
July 23, 2015
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/34; H01L21/285
Domestic Patent References:
| JP3122274A | ||||
| JP2009038295A | ||||
| JP2013058565A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda