Title:
基板処理装置および半導体装置の製造方法、エッチング装置
Document Type and Number:
Japanese Patent JP4421609
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a processing vessel evacuated by an evacuation system and including therein a stage for holding thereon a substrate to be processed, the processing vessel defining therein a processing space, a processing gas supply path that introduces an etching gas into the processing vessel, a plasma source that forms plasma in the processing space, and a high-frequency source connected to the stage. The processing vessel includes therein a shielding plate dividing the processing space into a first processing space part including a surface of the substrate to be processed and a second processing space part corresponding to a remaining part of the processing space, wherein the shielding plate is formed with an opening having a size larger than a size of the substrate to be processed.
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Inventors:
Yoichi Okida
Koji Ibi
Minoru Suzuki
Yuichi Tateno
Koji Ibi
Minoru Suzuki
Yuichi Tateno
Application Number:
JP2006512430A
Publication Date:
February 24, 2010
Filing Date:
March 31, 2004
Export Citation:
Assignee:
Fujitsu Microelectronics Limited
International Classes:
H01L21/3065; H01J37/32; H01L21/00; H01L21/3213; H01L21/8246; H01L27/105
Domestic Patent References:
| JP2000012523A | ||||
| JP9139358A | ||||
| JP5121362A | ||||
| JP5102085A | ||||
| JP2003168676A | ||||
| JP2002075963A |
Attorney, Agent or Firm:
Tadahiko Ito