Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2021197449
Kind Code:
A
Abstract:
To provide a substrate processing device effective in speeding up adjustment of a removal width of a film formed on a substrate.SOLUTION: A substrate processing device includes a periphery removal unit that removes a peripheral portion of a film formed on the surface of a substrate, a profile acquisition unit that acquires a removal width profile representing a relationship between a position in the circumferential direction of the substrate and a width of the portion of the substrate on which the film has been removed, and a factor estimation unit that outputs factor information indicating the factors of a width error on the basis of the removal width profile.SELECTED DRAWING: Figure 4
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Inventors:
NAKAMURA YASUYUKI
TADOKORO MASATAKA
ENOMOTO MASASHI
TADOKORO MASATAKA
ENOMOTO MASASHI
Application Number:
JP2020102961A
Publication Date:
December 27, 2021
Filing Date:
June 15, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; B05C11/08; B05C11/10; B05D3/10
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo