Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP6468916
Kind Code:
B2
Abstract:
A substrate processing apparatus (1) includes a processing part (11), a supply tank (12), and a recovery tank (13). In the supply tank (12), a processing liquid (91) circulates through a first circulation passage (211), and the temperature of the processing liquid is adjusted. The processing part performs etching processing on a substrate (9), using processing liquid from the first circulation passage. The used processing liquid is guided to the recovery tank and circulates through a second circulation passage (223). The second circulation passage includes a heater (224), a metal removal filter (231), and a metal concentration meter (233). The metal removal filter removes metal ions in the processing liquid. The metal concentration meter measures the metal ion concentration in the processing liquid, and the supply tank is replenished with appropriate processing liquid (91) from the recovery tank. This improves the utilization ratio of the processing liquid in etching processing.
Inventors:
Iwa saki Akihisa
Higuchi Ayumi
Higuchi Ayumi
Application Number:
JP2015071147A
Publication Date:
February 13, 2019
Filing Date:
March 31, 2015
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/306
Domestic Patent References:
| JP2009218405A | ||||
| JP2002270568A | ||||
| JP9167752A | ||||
| JP2008252049A | ||||
| JP11162902A | ||||
| JP2003257932A | ||||
| JP2013074252A | ||||
| JP2004330056A |
Foreign References:
| WO2012017524A1 |
Attorney, Agent or Firm:
Masahiro Matsusaka
Tsutomu Tanaka
Masamichi Ida
Tsutomu Tanaka
Masamichi Ida