Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7391793
Kind Code:
B2
Abstract:
The present invention provides a device for processing a substrate which can efficiently remove static electricity generated on the substrate. The device for processing a substrate comprises: a support unit supporting a substrate and including a support plate; a lower fluid supply unit supplying a fluid to a lower portion of the substrate supported by the support unit; a static electricity removing unit removing static electricity of the substrate supported by the support unit; and a controller, wherein the static electricity removing unit includes a static electricity removing plate provided to be spaced apart from a lower surface of the substrate supported by the support unit, and the controller supplies the fluid to the lower portion of the substrate and controls the lower fluid supply unit to form a liquid film in a space between a lower surface of the substrate and the static electricity removing unit.
Inventors:
Park, Shi Hyun
Application Number:
JP2020137050A
Publication Date:
December 05, 2023
Filing Date:
August 14, 2020
Export Citation:
Assignee:
Cemes Company, Limited
International Classes:
H01L21/304; H01L21/683; H05F3/02
Domestic Patent References:
| JP2007012887A | ||||
| JP2017183389A | ||||
| JP2011103438A | ||||
| JP2005123534A | ||||
| JP2007184363A | ||||
| JP10172880A |
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi