基板処理装置、および基板処理方法 - 東京エレクトロン株式会社

Title:

基板処理装置、および基板処理方法

Document Type and Number:

Japanese Patent JP7442314

Kind Code:

B2

Abstract:

A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid for each area and controls the moving part to scan the polishing head for each area while a subsequent supply of the cleaning liquid is stopped.

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Inventors:

Osamu Miyahara

Application Number:

JP2019233131A

Publication Date:

March 04, 2024

Filing Date:

December 24, 2019

Export Citation:

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